small signal product - fast switching speed - surface mount device type - moisture sensitivity level 1 - matte tin (sn) lead finish with nickel (ni) underplate - pb free version and rohs compliant - packing code with suffix "g" means green compound (halogen-free) - case: sot-23 small outline plastic package - weight: 8 0.5 mg symbol unit p d mw v rrm v i frm ma i o ma i fsm a r ja o c/w t j , t stg o c 2. valid provided that electrodes are kept at ambient temperature symbol unit v r(br) v i r a c j pf trr ns document number: ds_s1412039 version: d14 bas21 / a / c / s taiwan semiconductor 225mw smd switching diode features sot-23 mechanical data - terminal: matte tin plat ed, lead free., solderable per mil-std-202, method 208 guaranteed - high temperature soldering guaranteed : 260c/10s maximum ratings and electrical characteristics (t a =25c unless otherwise noted) parameter value 625 200 mean forward current repetitive peak forward current 225 250 repetitive peak reverse voltage power dissipation non-repetitive peak forward surge current 1 thermal resistance (junction to ambient) 500 (note 2) (note 1) -55 to +150 notes : 1. test condition : 8.3 ms single half sine-wave superimposed on rated load (jedec method) pulse width = 1 sec min max junction and storage temperature range parameter reverse breakdown voltage 250 - forward voltage -1.00 v -1.25 reverse leakage current -0.1 v f junction capacitance -5 reverse recovery time -50 i f = i r = 30ma , r l = 100 ? , i rr = 1ma v r = 1 v , f = 1.0 mhz v r = 200 v i f = 200 ma i f = 100 ma i r = 100 a
small signal product (t a =25c unless otherwise noted) document number: ds_s1412039 version: d14 bas21 / a / c / s taiwan semiconductor ratings and characteristics curves 0.01 0.1 1 10 100 0 40 80 120 160 200 reverse current ( a) t j , junction temperature ( o c) fig. 2 reverse current vs. junction temperature v r =200v 0.01 0.1 1 10 100 1000 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 instantaneous forward current (ma) instantaneous forward voltage (v) fig. 1 typical forward characteristics 0 50 100 150 200 250 0 25 50 75 100 125 150 175 200 power dissipation (mw) ambient temperature ( o c) fig. 3 admissible power dissipation curve
ordering information part no. note 1: "xx" is device code "1" thru "1s" note 2: part no. suffix ?-xx ? would be used for special requirement part no. package outline dimensions min max min max a 2.70 3.10 0.106 0.122 b 1.10 1.50 0.043 0.059 c 0.30 0.51 0.012 0.020 d 1.78 2.04 0.070 0.080 e 2.10 2.64 0.083 0.104 f 0.89 1.30 0.035 0.051 g h suggest pad layout z x y c e document number: ds_s1412039 version: d14 bas21 / a / c / s taiwan semiconductor small signal product part no. suffix (note 2) packing code packing code suffix package packing bas2xx (note 1) -xx rf gsot-23 3k / 7" reel r5 10k / 13" reel example preferred p/n part no. suffix packing code packing code suffix description bas21 rf bas21 rf multiple manufacture source bas21 rfg bas21 rf g multiple manufacture source green compound bas21-b0 rfg bas21 -b0 rf g defined manufacture source green compound 2.8 0.110 dim. unit (mm) unit (inch) 0.55 ref 0.022 ref 0.10 ref 0.004 ref 0.028 0.9 0.035 1.9 0.075 dim. unit (mm) unit (inch) typ. typ. 1.0 0.039 bas21-d0 rfg bas21 -d0 rf g defined manufacture source green compound 0.7
pin configuration bas21 bas21a bas21c bas21s marking marking js js2 js3 js4 document number: ds_s1412039 version: d14 small signal product bas21 / a / c / s taiwan semiconductor bas21a bas21c bas21s bas21 part no.
small signal product assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_s1412039 version: d14 bas21 / a / c / s taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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